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Patent Searching and Data


Title:
JOINED BODY JOINED BY CHEMICAL BONDING AT MATERIAL INTERFACE, AND JOINING METHOD FOR JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2015/030079
Kind Code:
A1
Abstract:
Provided is a joined body for which there is no risk of peel-off from the joining surface even without using an adhesive, it is possible to control joining and detachment, and which is reversible. Also provide is a method for manufacturing the joined body. In the joined body, a chemical bond is formed by chemical reaction of at least two of the same or different solid materials at the contact interfaces thereof.

Inventors:
HARADA AKIRA (JP)
YAMAGUCHI HIROYASU (JP)
HASHIDZUME AKIHITO (JP)
TAKASHIMA YOSHINORI (JP)
SEKINE TOMOKO (JP)
KOBAYASHI YUICHIRO (JP)
NAKAHATA MASAKI (JP)
Application Number:
PCT/JP2014/072488
Publication Date:
March 05, 2015
Filing Date:
August 27, 2014
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Assignee:
UNIV OSAKA (JP)
International Classes:
C08J5/12; B32B7/04; C12N9/96
Foreign References:
JP2011001481A2011-01-06
JP2006312278A2006-11-16
JP2008528508A2008-07-31
Other References:
AKIRA HARADA ET AL.: "Macroscopic self-assembly through molecular recognition", NATURE CHEMISTRY, vol. 3, 2011, pages 34 - 37
AKIRA HARADA: "Jiko Shufuku Cho Bunshi Material", KOBUNSHI, vol. 62, 2013, pages 371 - 373
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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