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Patent Searching and Data


Title:
JOINED BODY OF HETEROGENOUS MATERIALS AND HOUSING FOR STORING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/164008
Kind Code:
A1
Abstract:
Provided is a joined body of heterogenous materials having a joining part at which a resinous rib and a metal substrate are joined to each other. The metal substrate has a convex part formed thereon that protrudes inside the resinous rib in at least some of the joining part.

Inventors:
TOMINAGA TAKAHIRO (JP)
KIMURA KAZUKI (JP)
MISUMI MASAKI (JP)
SHINBORI NOBUYOSHI (JP)
Application Number:
JP2019/007209
Publication Date:
August 29, 2019
Filing Date:
February 26, 2019
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B29C45/14; H05K5/02; H05K5/04
Domestic Patent References:
WO2009031632A12009-03-12
WO2015008847A12015-01-22
Foreign References:
JPH11298158A1999-10-29
JP2017001317A2017-01-05
JP2014091263A2014-05-19
JP2016032048A2016-03-07
JP2012045920A2012-03-08
JPH0629684A1994-02-04
JP2014014997A2014-01-30
JP2018031889A2018-03-01
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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