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Patent Searching and Data


Title:
JOINED BODY OF HETEROGENOUS MATERIALS AND HOUSING FOR STORING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/164008
Kind Code:
A1
Abstract:
Provided is a joined body of heterogenous materials having a joining part at which a resinous rib and a metal substrate are joined to each other. The metal substrate has a convex part formed thereon that protrudes inside the resinous rib in at least some of the joining part.

Inventors:
TOMINAGA Takahiro (Inc. 580-32, Nagaura, Sodegaura-sh, Chiba 65, 〒2990265, JP)
KIMURA Kazuki (Inc. 580-32, Nagaura, Sodegaura-sh, Chiba 65, 〒2990265, JP)
MISUMI Masaki (Inc. 580-32, Nagaura, Sodegaura-sh, Chiba 65, 〒2990265, JP)
SHINBORI Nobuyoshi (Inc. 580-32, Nagaura, Sodegaura-sh, Chiba 65, 〒2990265, JP)
Application Number:
JP2019/007209
Publication Date:
August 29, 2019
Filing Date:
February 26, 2019
Export Citation:
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Assignee:
MITSUI CHEMICALS, INC. (5-2 Higashi-Shimbashi 1-chome, Minato-ku Tokyo, 22, 〒1057122, JP)
International Classes:
B29C45/14; H05K5/02; H05K5/04
Attorney, Agent or Firm:
HAYAMI Shinji (KDX Gotanda Bldg. 9F, 9-2 Nishi-Gotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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