Title:
JOINED BODY MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/230899
Kind Code:
A1
Abstract:
Provided are: a joined body manufacturing method including a step for preparing a substrate A having a surface with projection parts and a substrate B having a wiring terminal, a step for forming a filler-containing layer which includes a binder and a filler on the surface of the substrate A with the projection parts, a step for planarizing the filler-containing layer together with the projection parts and exposing at least a portion of the projection parts from the filler-containing layer, and thereby obtaining a laminate, and a step for joining the surface of the laminate having the filler-containing layer and at least a portion of the wiring terminal of the substrate B; a method for manufacturing a semiconductor device comprising the joined body obtained by the manufacturing method; and a resin composition for use in the manufacturing method.
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Inventors:
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2022/018934
Publication Date:
November 03, 2022
Filing Date:
April 26, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/60; C08K3/10; C08L101/00; G03F7/004; H01L21/304; H01L23/29; H01L23/31; H05K7/20
Domestic Patent References:
| WO2017175481A1 | 2017-10-12 |
Foreign References:
| JP2011216565A | 2011-10-27 | |||
| JP2008084951A | 2008-04-10 | |||
| JP2008235527A | 2008-10-02 | |||
| JP2017206620A | 2017-11-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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