Title:
JOINED BODY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/187577
Kind Code:
A1
Abstract:
[Problem] To configure a joined body that joins a piezoelectric material substrate comprising lithium tantalite or the like to a support substrate such that the reduction of voltage resistance of an electrode is suppressed while improving heat discharge from the piezoelectric material substrate. [Solution] A joined body 8 (8A) comprises: a support substrate 3; a piezoelectric material substrate 1 (1A) comprising a material selected from the group consisting of lithium niobate, lithium tantalate, and lithium niobate-lithium tantalate; and an amorphous layer 7 that contacts a joining surface 6 of the support substrate 3, and a joining surface 5 of the piezoelectric material substrate 1 (1A). The thermal resistance TR from the joining surface 6 of the support substrate 3, through the amorphous layer 7, to the joining surface 5 of the piezoelectric material substrate 1 (1A) is greater than or equal to 1.0 × 10-6m2 K/W, and less than or equal to 3.0 × 10-6m2 K/W.
Inventors:
HORI YUJI (JP)
Application Number:
PCT/JP2019/002653
Publication Date:
October 03, 2019
Filing Date:
January 28, 2019
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2014077213A1 | 2014-05-22 | |||
| WO2012033125A1 | 2012-03-15 | |||
| WO2013031617A1 | 2013-03-07 |
Foreign References:
| JP2017169172A | 2017-09-21 | |||
| JP2004343359A | 2004-12-02 |
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
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