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Title:
JOINED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/196132
Kind Code:
A1
Abstract:
A joined structure of the present invention is a joined structure in which a substrate having a circuit pattern and a member to be joined having an electrode terminal are joined via a conductive joining material, and is characterized by satisfying the following formula (1): SQRT(X)/SQRT(Y) ≥ 2.9209 × λ-0.141 where X represents a contact area between the circuit pattern and the conductive joining material, Y represents a contact area between the electrode terminal and the conductive joining material, and λ represents heat conductivity of the conductive joining material.

Inventors:
ISHIKAWA FUMIAKI (JP)
YAMAGUCHI TOMOHIKO (JP)
MASUYAMA KOTARO (JP)
IWATA KOUTAROU (JP)
Application Number:
PCT/JP2020/011883
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; H01L21/60; H01L23/36; H01L23/373; H01L33/62
Foreign References:
JP2014007366A2014-01-16
JP2018032608A2018-03-01
JP2013051389A2013-03-14
JP2005129874A2005-05-19
JP2019055366A2019-04-11
JP2014103314A2014-06-05
JP2018172792A2018-11-08
JP2018168226A2018-11-01
JP2018152176A2018-09-27
JP2016204733A2016-12-08
Other References:
See also references of EP 3944303A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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