JOINED SUBSTRATE AND PRODUCTION METHOD FOR JOINED SUBSTRATE

WIPO Patent Application WO/2020/184510

A1

The present invention inhibits movement of silver from a protrusion portion due to an ion migration phenomenon to prevent occurrence of defects in a joined substrate caused by the movement of silver from the protrusion portion, while inhibiting a defect in the joined substrate caused by concentration of stress to an end portion of a copper plate. The joined substrate comprises a silicon nitride ceramic substrate, a copper plate, and a joining layer. The joining layer joins the copper plate to the silicon nitride ceramic substrate. The copper plate and the joining layer are disposed on the silicon nitride ceramic substrate. The joining layer comprises an inter-plate portion between the silicon nitride ceramic substrate and the copper plate, and a protrusion portion protruding from between the silicon nitride ceramic substrate and the copper plate. The protrusion portion does not contain silver.

WO/2015/112695	SUBSTRATE AND METHOD OF FORMING THE SAME
WO/2005/107345	MICROELECTRONIC CONNECTION COMPONENTS HAVING BONDABLE WIRES
JP3323074	WIRING BOARD, PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT AND ITS MOUNTING STRUCTURE

EBIGASE TAKASHI (JP)
MASUDA IZUMI (JP)

PCT/JP2020/009983

September 17, 2020

March 09, 2020

Click for automatic bibliography generation  

NGK INSULATORS LTD (JP)

H01L23/13; H05K1/03; H05K3/38

WO2017200004A1	2017-11-23
WO2017006661A1	2017-01-12
WO2011034075A1	2011-03-24

JP2018506496A	2018-03-08
JP2005268821A	2005-09-29
JP2001339155A	2001-12-07
JP2017035805A	2017-02-16

YOSHITAKE Hidetoshi et al. (JP)

View/Download PDF      PDF Help

Previous Patent: CERAMIC SINTERED BODY AND CERAMIC POWDER

Next Patent: TEMPERATURE SENSOR UNIT, AND BODY CORE THERMOMETER