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Title:
JOINING DEVICE AND JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/190384
Kind Code:
A1
Abstract:
Provided are a joining device and a joining method which are capable of easily implementing joining that involves the activation of a joining surface. Specifically, this joining device 100, which joins a first element 21 and a second element 23, has: an activation part 30 which activates a first joining surface which is a joining surface of the first element 21, and a second joining surface which is a joining surface of the second element 23; and a joining part 10 which from a state where the first joining surface and the second joining surface are made to face each other with a predetermined gap therebetween, causes the first joining surface and the second joining surface to approach each other and be joined to each other by irradiation with active energy rays.

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Inventors:
OKADA TATSUYA (JP)
KAZAMA KOICHI (JP)
ZINDA TOSHIYUKI (JP)
ARAI YOSHIYUKI (JP)
Application Number:
PCT/JP2023/012288
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B23K20/00; H01L21/60; H01L21/02; H01L21/50; H01L25/065; H01L25/07; H01L25/18
Foreign References:
US20210375620A12021-12-02
JP2019527465A2019-09-26
JP2019503081A2019-01-31
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