Title:
JOINING DEVICE AND JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/249035
Kind Code:
A1
Abstract:
This joining device comprises: a stage (141) that holds a substrate (W1); a head (142) that is arranged facing the stage (141) and that holds a substrate (W2); and particle beam sources (161, 162), each of which radiates a particle beam to a region including a section of a joining surface of the substrates (W1, W2). In addition, each of the particle beam source (161, 162) has a plurality of radiation ports that are arranged in a direction along the joining surface of the substrates (W1, W2) onto which the particle beam is radiated. An opening area of each of the plurality of radiation ports is set so as to be greater for a radiation port that is arranged at a position more distant from a longitudinal center section of a discharging chamber.
Inventors:
YAMAUCHI AKIRA (JP)
KAWASAKI TOMOYOSHI (JP)
KAWASAKI TOMOYOSHI (JP)
Application Number:
PCT/JP2023/022858
Publication Date:
December 28, 2023
Filing Date:
June 21, 2023
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/02; B23K20/00; H01L21/265
Foreign References:
| JP2015173247A | 2015-10-01 | |||
| JP2018201022A | 2018-12-20 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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