JOINING MATERIAL AND JOINING METHOD USING SAME - DOWA ELECTRONICS MATERIALS CO

Title:

JOINING MATERIAL AND JOINING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2014/204013

Kind Code:

A1

Abstract:

A joining material consisting essentially of a silver paste which comprises silver nanoparticles that are coated with hexanoic acid or other organic compound having at most 8 carbon atoms and that have a mean primary particle diameter of 1 to 50nm, silver micro- particles that are coated with an organic compound such as oleic acid and that have a mean primary particle diameter of 0.5 to 4μm, a solvent consisting of 3 to 7 mass% of an alcohol and 0.3 to 1 mass% of a triol, a dispersant consisting of 0.5 to 2 mass% of an acid-based dispersant and 0.01 to 0.1 mass% of a phosphate ester-based dispersant, and 0.01 to 0.1 mass% of a sintering aid such as diglycolic acid, wherein: the content of the silver nanoparticles is 5 to 30 mass%; the content of the silver microparticles is 60 to 90 mass%; and the total content of the silver nanoparticles and the silver microparticles is 90 mass% or more.

Inventors:

ENDOH KEIICHI (JP)
NAGAOKA MINAMI (JP)
KURITA SATORU (JP)
MIYOSHI HIROMASA (JP)
KOHNO YOSHIKO (JP)
MIYAZAWA AKIHIRO (JP)

Application Number:

PCT/JP2014/066916

Publication Date:

December 24, 2014

Filing Date:

June 19, 2014

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

B22F1/052; B22F1/054; B22F1/0545; B22F1/102; B22F1/107; B22F7/08; H05K3/32

Domestic Patent References:

WO2012070262A1	2012-05-31
WO2011155055A1	2011-12-15

Foreign References:

JP2012052198A	2012-03-15
JP2010153118A	2010-07-08
JP2011080147A	2011-04-21
JP2011240406A	2011-12-01
JP2013004309A	2013-01-07

Other References: