Title:
JOINING MATERIAL, PRODUCTION METHOD FOR JOINING MATERIAL, AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2021/075463
Kind Code:
A1
Abstract:
A joined body (10) in which a conductor (12) and a substrate (14) are joined by a joining material (13). The joining material (13) includes a sintered body that is formed by sintering silver powder. The porosity of the sintered body is 8%–30%, and the surface roughness Ra of joining surfaces of the sintered body is at least 500 nm but no more than 3.3 μm.
Inventors:
JIU JINTING (JP)
Application Number:
PCT/JP2020/038781
Publication Date:
April 22, 2021
Filing Date:
October 14, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B22F7/08; B22F1/00; B22F3/11; C22C1/04
Domestic Patent References:
| WO2019026799A1 | 2019-02-07 |
Foreign References:
| JP2012052198A | 2012-03-15 | |||
| JP2014213325A | 2014-11-17 | |||
| JP2019188913A | 2019-10-31 | |||
| JP4876979B2 | 2012-02-15 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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