Title:
JOINING METHOD, JOINING DEVICE AND JOINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/158520
Kind Code:
A1
Abstract:
This joining method, for joining two substrates (W1, W2) involves: a heat treatment step which in which the joining surfaces of two substrates (W1, W2) to be joined together are heated to a temperature higher than 60°C in a reduced pressure atmosphere; an activation treatment step in which, after the heat treatment step the joining surfaces of the two substrates (W1, W2) are activated in a state in which the reduced pressure atmosphere is maintained; and a joining step in which, after the activation treatment step the two substrates (W1, W2) are joined in a state in which the reduced pressure atmosphere is maintained. Further, in the heat treatment step, in a state in which the reduced pressure atmosphere is maintained, the state in which the joining surfaces of the two substrates (W1, W2) have been heated to a temperature higher than 60°C may be optionally maintained for at least 30 seconds. The air pressure in the heat treatment step is optionally less than or equal to 10-2 Pa.
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Inventors:
SUGA TADATOMO (JP)
YAMAUCHI AKIRA (JP)
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2022/001970
Publication Date:
July 28, 2022
Filing Date:
January 20, 2022
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
SUGA TADATOMO (JP)
SUGA TADATOMO (JP)
International Classes:
B23K20/00; H01L21/02
Domestic Patent References:
WO2015163461A1 | 2015-10-29 | |||
WO2017155002A1 | 2017-09-14 | |||
WO2012105474A1 | 2012-08-09 |
Foreign References:
JP2014103291A | 2014-06-05 | |||
JP2018074050A | 2018-05-10 | |||
JP2004297693A | 2004-10-21 | |||
JP2010109949A | 2010-05-13 | |||
JP2008071787A | 2008-03-27 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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