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Patent Searching and Data


Title:
JOINING METHOD AND JOINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022015
Kind Code:
A1
Abstract:
This joining method includes: a first joining step for forming a first laminate by releasing hold of a first substrate and joining first and second substrates; and a second joining step for forming a second laminate by joining a third substrate with whichever substrate that has been thinned between the joined first and second substrates, wherein hold of the third substrate is released in the second joining step when the first substrate has been thinned, and hold of the first laminate is released in the second joining step when the second substrate has been thinned.

Inventors:
MAEHARA Yoshihiro (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
KAMASHITA Atsushi (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
MITSUISHI Hajime (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
FUKUDA Minoru (15-3 Konan 2-chome, Minato-k, Tokyo 90, 〒1086290, JP)
Application Number:
JP2019/026511
Publication Date:
January 30, 2020
Filing Date:
July 03, 2019
Export Citation:
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Assignee:
NIKON CORPORATION (15-3, Konan 2-chome Minato-k, Tokyo 90, 〒1086290, JP)
International Classes:
H01L21/02; B23K20/00; H01L21/683; H01L21/822; H01L25/16; H01L27/00; H01L27/04; H01L27/146
Domestic Patent References:
WO2017168531A12017-10-05
WO2017168534A12017-10-05
WO2017217431A12017-12-21
WO2017187738A12017-11-02
Foreign References:
JP2014107448A2014-06-09
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (22F Shinjuku L Tower, 1-6-1 Nishi-Shinjuku, Shinjuku-k, Tokyo 22, 〒1631522, JP)
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