JOINING METHOD - IHI CORP

Title:

JOINING METHOD

Document Type and Number:

WIPO Patent Application WO/2020/085492

Kind Code:

A1

Abstract:

Provided is a joining method for abutting and joining a first member (10) and a second member (20), the method including: a groove formation step for removing a portion of a first protruding part (12) that opposes a second protruding part (22), and removing a portion of the second protruding part (22) that opposes the first protruding part (12), thereby forming a groove region (Rg) between the first protruding part (12) and the second protruding part (22); a first welding step of joining the first member (10) and the second member (20) via butt welding; and a second welding step of filling in the groove region (Rg) via overlay welding. In the groove formation step, a surface of the first protruding part (12) that faces the groove region (Rg) becomes a first sloping surface (12d) that increases in distance, from the position of the joint with the second protruding part (22), moving toward the outer surface of the first protruding part (12), and a surface of the second protruding part (22) that faces the groove region (Rg) becomes a second sloping surface (22d) that increases in distance, from the position of the joint with the first protruding part (12), moving toward the outer surface of the second protruding part (22).

Inventors:

HATO ERIKO (JP)
NONOMURA SHOICHI (JP)
MATSUMOTO NAOYUKI (JP)
YAMAZAKI TETSUROU (JP)
SUGINO TOMOHIRO (JP)
INOSE KOUTAROU (JP)

Application Number:

PCT/JP2019/041912

Publication Date:

April 30, 2020

Filing Date:

October 25, 2019

Export Citation:

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Assignee:

IHI CORP (JP)

International Classes:

B23K33/00; B23K26/21; B23K26/342

Foreign References:

JP2016190254A	2016-11-10
JP2015199119A	2015-11-12
JPH07132386A	1995-05-23
JPH09132386A	1997-05-20
JP2018200660A	2018-12-20

Other References: