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Patent Searching and Data


Title:
JOINING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/086324
Kind Code:
A1
Abstract:
Provided is a highly reliable joining structure having excellent thermal fatigue resistance and thermal stress relaxation characteristics. This joining structure (M1) is provided with a first member (1), a second member (2) that can be joined to the first member, and a joining part (3) interposed between a first join surface (11) on the first member side and a second join surface (21) on the second member side that the first member and the second member are joined to each other. The joining part has at least: a joining layer (3210) that comprises an intermetallic compound and is joined to the first join surface, said layer (3210) comprising a first metal and a second metal that has a lower melting point than the first metal and having a higher melting point than the second metal; a reinforcing layer (30) comprising a third metal having a higher ductility than the first metal; and an intermediate layer (3110) comprising the first metal, the intermediate layer (3110) being joined to the joining layer and the reinforcing layer. A guide part (4), which comprises an intermetallic compound and directly connects to the reinforcing layer without the intermediate layer being interposed therebetween, is provided in at least a part of the outer periphery of the joining layer present in correspondence to the first bonded surface.

Inventors:
ITO HIROFUMI (JP)
USUI MASANORI (JP)
KUWAHARA MAKOTO (JP)
Application Number:
PCT/JP2016/083866
Publication Date:
May 26, 2017
Filing Date:
November 15, 2016
Export Citation:
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Assignee:
TOYOTA CHUO KENKYUSHO KK (JP)
International Classes:
H01L21/52; B23K1/00; H01L23/48
Foreign References:
JPH0515310B21993-03-01
JPS6360537A1988-03-16
US20030160021A12003-08-28
Attorney, Agent or Firm:
MORIOKA Masayuki et al. (JP)
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