Title:
JOINING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/090394
Kind Code:
A1
Abstract:
Provided is a joining structure that is composed of a laser-transmitting resin member and a laser-absorbing resin member. The laser-absorbing resin member includes a first resin component, which is not compatible with the laser-transmitting resin member, and a second resin component, which is compatible with the laser-transmitting resin member. The abundance ratio of the second resin component in a melted/solidified part that constitutes the joining portion of the laser-transmitting resin member and the laser-absorbing resin member is higher than the abundance ratio of the second resin component in the laser-absorbing resin member.
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Inventors:
SATO DAISUKE (JP)
NISHIKAWA KAZUYOSHI (JP)
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2016/082522
Publication Date:
June 01, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B32B27/00; B29C65/16; B32B7/023; B32B27/08
Foreign References:
| JP2006312303A | 2006-11-16 | |||
| JPH03143632A | 1991-06-19 | |||
| JP2002284895A | 2002-10-03 | |||
| JP2003526547A | 2003-09-09 |
Other References:
See also references of EP 3381682A4
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
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