Title:
JOINING SYSTEM, JOINING METHOD, PROGRAM AND COMPUTER MEMORY MEDIA
Document Type and Number:
WIPO Patent Application WO/2011/111565
Kind Code:
A1
Abstract:
A joining system has a conveyance in/out station that can retain a plurality of substrates or a plurality of polymerized substrates, and conveys a substrate or polymerized substrate into and out of a processing station; and a processing station that implements a predetermined process on a substrate and that joins substrates. The processing station has a surface activation apparatus that activates a substrate surface; a surface-hydrophilizing apparatus that hydrophilizes and cleans a substrate surface; a joining apparatus that joins substrates together; and a conveyance region for conveying the substrate or the polymerized substrate to the surface-activation apparatus, the surface-hydrophilizing apparatus, and the joining apparatus.
Inventors:
NISHIBAYASHI TAKAHIRO (JP)
IWASHITA YASUHARU (JP)
TAMURA TAKESHI (JP)
KITAYAMA TATSUYA (JP)
IWASHITA YASUHARU (JP)
TAMURA TAKESHI (JP)
KITAYAMA TATSUYA (JP)
Application Number:
PCT/JP2011/054606
Publication Date:
September 15, 2011
Filing Date:
March 01, 2011
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
NISHIBAYASHI TAKAHIRO (JP)
IWASHITA YASUHARU (JP)
TAMURA TAKESHI (JP)
KITAYAMA TATSUYA (JP)
NISHIBAYASHI TAKAHIRO (JP)
IWASHITA YASUHARU (JP)
TAMURA TAKESHI (JP)
KITAYAMA TATSUYA (JP)
International Classes:
H01L21/02; H01L21/677; H01L21/683
Foreign References:
| JP2009164197A | 2009-07-23 | |||
| JP2006258958A | 2006-09-28 | |||
| JP2004266071A | 2004-09-24 | |||
| JP2009212402A | 2009-09-17 | |||
| JPH02135722A | 1990-05-24 | |||
| JP2007036130A | 2007-02-08 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
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Claims: