Title:
JOINING SYSTEM AND JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/182255
Kind Code:
A1
Abstract:
In the present invention, a joining system comprises: a first joining device (1) that, in a state in which the joining portions of each of a plurality of substrates have been activated under reduced pressure, temporarily joins the plurality of substrates to each other by causing the joining parts of the plurality of substrates to contact each other; second joining devices (2A, 2B) that, under reduced pressure, perform main joining the plurality of substrates to each other by raising the temperature of the plurality of temporarily joined substrates to the main joining temperature, which is higher than the temporary joining temperature, and applying pressure to the plurality of substrates in the direction in which the substrates approach each other; and a conveying device (84) that, in a state of reduced pressure, conveys the plurality of substrates that have been temporarily joined to each other from the first joining device (1) to the second joining devices (2A, 2B).
Inventors:
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2023/010823
Publication Date:
September 28, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/02; B23K20/00
Foreign References:
| JP2009220151A | 2009-10-01 | |||
| JPH09155568A | 1997-06-17 | |||
| JP2012138418A | 2012-07-19 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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