Title:
JOINT BODY AND INSULATING CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/088222
Kind Code:
A1
Abstract:
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the copper member (12), a crystalline active metal compound layer (31) formed of a compound containing an active metal is formed closer to the ceramic member (11).
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2018/040682
Publication Date:
May 09, 2019
Filing Date:
November 01, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B23K1/00; H01L23/12; H01L23/36; B23K35/26; B23K35/28; B23K35/30; C22C9/00; C22C9/02; C22C9/06; C22C13/00; C22C21/00
Domestic Patent References:
| WO2018021472A1 | 2018-02-01 |
Foreign References:
| JP2002201076A | 2002-07-16 | |||
| JP2012136378A | 2012-07-19 | |||
| JP2003192462A | 2003-07-09 | |||
| JP2017035805A | 2017-02-16 | |||
| JP2017213155A | 2017-12-07 | |||
| JP2018204040A | 2018-12-27 | |||
| JP3211856B2 | 2001-09-25 | |||
| JPS5828352B2 | 1983-06-15 |
Other References:
See also references of EP 3705464A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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