Title:
JOINT STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM FOR SAME
Document Type and Number:
WIPO Patent Application WO/2012/002273
Kind Code:
A1
Abstract:
Provided is a soldering method which reduces position deviations between substrates even though the defluxing process can be omitted. A temporary fixing agent (55) is applied to a plurality of substrates (50a, 50b), the substrates (50a, 50b) are heated by a heater (33) in a state in which the substrates (50a, 50b) are temporarily fixed to each other by way of the temporary fixing agent (55), the temporary fixing agent (55) is evaporated before a solder (54) is melted or while the solder (54) is being melted, and the substrates (50a, 50b) are soldered and joined to each other by way of the molten solder (54).
Inventors:
ABE, Hideyuki (60, Kagumachi, Besshocho, Himeji-sh, Hyogo 25, 〒6710225, JP)
阿部 英之 (〒25 兵庫県姫路市別所町家具町６０番地 アユミ工業株式会社内 Hyogo, 〒6710225, JP)
阿部 英之 (〒25 兵庫県姫路市別所町家具町６０番地 アユミ工業株式会社内 Hyogo, 〒6710225, JP)
Application Number:
JP2011/064532
Publication Date:
January 05, 2012
Filing Date:
June 24, 2011
Export Citation:
Assignee:
AYUMI INDUSTRY CO., LTD. (60 Kagumachi, Besshocho Himeji-sh, Hyogo 25, 〒6710225, JP)
アユミ工業株式会社 (〒25 兵庫県姫路市別所町家具町６０番地 Hyogo, 〒6710225, JP)
ABE, Hideyuki (60, Kagumachi, Besshocho, Himeji-sh, Hyogo 25, 〒6710225, JP)
アユミ工業株式会社 (〒25 兵庫県姫路市別所町家具町６０番地 Hyogo, 〒6710225, JP)
ABE, Hideyuki (60, Kagumachi, Besshocho, Himeji-sh, Hyogo 25, 〒6710225, JP)
International Classes:
H05K3/34; B23K1/00; B23K1/008; B23K31/02; H01L21/60; B23K101/40; B23K101/42
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
Claims: