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Title:
JUNCTION-GLASS CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH
Document Type and Number:
WIPO Patent Application WO/2010/097908
Kind Code:
A1
Abstract:
Provided is a junction-glass cutting method for cutting a junction glass, in which a plurality of glass substrates are junctioned on their junction faces through a junction material, along a cut-scheduled line. The junction glass cutting method is characterized by comprising a first laser irradiating step of emitting a first laser to irradiate a beam of the absorption band wavelength of the junction material, along the cut-scheduled line, thereby to separate the junction material on the cut-scheduled line from the junction faces, a second laser irradiating step of emitting a second laser to irradiate a beam of the absorption band wavelength of the junction material, along the cut-scheduled line, thereby to form a groove in one face of the junction glass, and a cutting step of cutting the junction glass along the cut-scheduled line by applying a splitting stress to the cut-scheduled line of the junction glass.

Inventors:
NUMATA MASASHI (JP)
Application Number:
PCT/JP2009/053337
Publication Date:
September 02, 2010
Filing Date:
February 25, 2009
Export Citation:
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Assignee:
SEIKO INSTR INC (JP)
NUMATA MASASHI (JP)
International Classes:
B23K26/00; C03B33/07; C03B33/09; H01L21/301; H03H3/02
Foreign References:
JP2004182530A2004-07-02
JP2008252805A2008-10-16
JP2002346782A2002-12-04
JP2006157872A2006-06-15
Attorney, Agent or Firm:
MATSUSHITA, YOSHIHARU (JP)
Matsushita Yoshiharu (JP)
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