Title:
JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AND SOLDER BALL
Document Type and Number:
WIPO Patent Application WO/2020/217833
Kind Code:
A1
Abstract:
The present invention provides a junction structure, a method for manufacturing the junction structure, and solder balls which can improve quality. A junction structure 11 comprises: a first structure 12; and a second structure 16 joined to the first structure 12 via a joint portion 14 composed of an Au-Sn alloy, the joint portion 14 having a thickness t of 3-50 μm.
Inventors:
TANAKA MASAMOTO (JP)
KOMORI KIYOTSUGU (JP)
AKASHI KEISUKE (JP)
HOSHINO KATSUHIKO (JP)
YAMAZAKI TSUNEKAZU (JP)
KOBAYASHI TAKAYUKI (JP)
YAMAMOTO SUKEYOSHI (JP)
MISAWA KENSUKE (JP)
KOMORI KIYOTSUGU (JP)
AKASHI KEISUKE (JP)
HOSHINO KATSUHIKO (JP)
YAMAZAKI TSUNEKAZU (JP)
KOBAYASHI TAKAYUKI (JP)
YAMAMOTO SUKEYOSHI (JP)
MISAWA KENSUKE (JP)
Application Number:
PCT/JP2020/013428
Publication Date:
October 29, 2020
Filing Date:
March 25, 2020
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
NIPPON MICROMETAL CORP (JP)
NIPPON MICROMETAL CORP (JP)
International Classes:
B23K1/00; B23K35/30; C22C5/02
Foreign References:
| JP2014054653A | 2014-03-27 | |||
| JP2017100176A | 2017-06-08 | |||
| JP2017189793A | 2017-10-19 | |||
| JP2018065149A | 2018-04-26 |
Attorney, Agent or Firm:
DORAIT IP LAW FIRM (JP)
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