Title:
KNOCKOUT DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/043148
Kind Code:
A1
Abstract:
A knockout device (10) which drives an upper die unit for punching a printed board is, in order to reduce the frictional force acting on a movable pad, reduce the wear between the outer peripheral surface of the movable pad and the inner peripheral surface of a containing hole, and improve the performance of punching the printed board, provided with: body members (11, 13) which are fixed to the lower end of a slide (2); a guide hole (14) which is bored in the annular body member (13); a movable pad (16) mounted in the guide hole (14) in a vertically movable manner; a hydraulic cylinder (17) which is formed at the annular body member (13) and the movable pad (16) and capable of driving the movable pad (16) to move downward; and a plurality of spring mechanisms (18) which elastically press the movable pad (16) upward to the upper limit position. The outer peripheral surface of the movable pad (16) is formed as a polygonal cylinder surface (16a) having a regular-octagonal cross section, and the respective ridge line parts and the vicinities thereof form partially circularly-cylindrical surfaces (7) so that at least two of the partially circularly-cylindrical surfaces (7) are constantly in sliding contact with the inner peripheral surface of a guide hole (6).
Inventors:
KITAURA Ichiro (14-7Konoike 2-chome,Itami-sh, Hyogo 02, 〒6648502, JP)
Application Number:
JP2010/065276
Publication Date:
April 14, 2011
Filing Date:
September 07, 2010
Export Citation:
Assignee:
PASCAL ENGINEERING CORPORATION (14-7, Konoike 2-chome Itami-sh, Hyogo 02, 〒6648502, JP)
パスカルエンジニアリング株式会社 (〒02 兵庫県伊丹市鴻池２丁目１４番７号 Hyogo, 〒6648502, JP)
パスカルエンジニアリング株式会社 (〒02 兵庫県伊丹市鴻池２丁目１４番７号 Hyogo, 〒6648502, JP)
International Classes:
B26F1/02; B21D28/00; H05K3/00
Attorney, Agent or Firm:
OKAMURA, Toshio (OKAMURA TOKKYO JIMUSYO, Kondo Bldg. 5F4-12, Nishitemma 4-chome,Kita-ku, Osaka-shi, Osaka 47, 〒5300047, JP)
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