Title:
KNOCKOUT DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/043148
Kind Code:
A1
Abstract:
A knockout device (10) which drives an upper die unit for punching a printed board is, in order to reduce the frictional force acting on a movable pad, reduce the wear between the outer peripheral surface of the movable pad and the inner peripheral surface of a containing hole, and improve the performance of punching the printed board, provided with: body members (11, 13) which are fixed to the lower end of a slide (2); a guide hole (14) which is bored in the annular body member (13); a movable pad (16) mounted in the guide hole (14) in a vertically movable manner; a hydraulic cylinder (17) which is formed at the annular body member (13) and the movable pad (16) and capable of driving the movable pad (16) to move downward; and a plurality of spring mechanisms (18) which elastically press the movable pad (16) upward to the upper limit position. The outer peripheral surface of the movable pad (16) is formed as a polygonal cylinder surface (16a) having a regular-octagonal cross section, and the respective ridge line parts and the vicinities thereof form partially circularly-cylindrical surfaces (7) so that at least two of the partially circularly-cylindrical surfaces (7) are constantly in sliding contact with the inner peripheral surface of a guide hole (6).
Inventors:
KITAURA ICHIRO (JP)
Application Number:
PCT/JP2010/065276
Publication Date:
April 14, 2011
Filing Date:
September 07, 2010
Export Citation:
Assignee:
PASCAL ENG CORP (JP)
KITAURA ICHIRO (JP)
KITAURA ICHIRO (JP)
International Classes:
B26F1/02; B21D28/00; H05K3/00
Foreign References:
| JPH11179444A | 1999-07-06 | |||
| JPH0929350A | 1997-02-04 | |||
| JPH0670923U | 1994-10-04 |
Attorney, Agent or Firm:
OKAMURA, TOSHIO (JP)
Toshio Okamura (JP)
Toshio Okamura (JP)
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