Title:
LAID SURFACE FLOOR MATERIAL AND FLOOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2006/095685
Kind Code:
A1
Abstract:
A laid surface floor material installable and removable without damaging the existing floor surface and the floor backing material of a building and having excellent stability and durability on a formed floor surface. The laid surface floor material placed on the existing floor surface or the floor backing material of the building comprises a base material of 3 mm or less in thickness and a surface floor material joined onto the base material. The base material is joined to the surface floor material so that its average adhesive strength measured by a prescribed method is 0.5 N or higher.
Inventors:
INOKUCHI YUKIO (JP)
Application Number:
PCT/JP2006/304277
Publication Date:
September 14, 2006
Filing Date:
March 06, 2006
Export Citation:
Assignee:
MITSUBISHI CHEM FUNCTIONAL PRO (JP)
INOKUCHI YUKIO (JP)
INOKUCHI YUKIO (JP)
International Classes:
E04F15/02; E04F15/00; E04F15/18
Foreign References:
| JPH0530335U | 1993-04-20 | |||
| JPH05302424A | 1993-11-16 | |||
| JP2003138239A | 2003-05-14 | |||
| JP2004019123A | 2004-01-22 |
Attorney, Agent or Firm:
Shigeno, Tsuyoshi (9F 5-10, Shinjuku 2-chom, Shinjuku-ku Tokyo 22, JP)
Download PDF: