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Title:
LAMINATE BODY, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PRODUCING LAMINATE BODY
Document Type and Number:
WIPO Patent Application WO/2013/147050
Kind Code:
A1
Abstract:
The problem addressed by the present invention is to provide a laminate body such as a conductive pattern having superior adhesion at the interfaces between a layer comprising a support body, a conductive layer containing a conductive substance, and a plating layer. The present invention pertains to: a laminate body having at least a support body layer (I), a conductive layer (II), and a plating layer (III), and characterized by the conductive layer (II) having an oxidized surface, and the plating layer (III) being laminated to the oxidized surface of the conductive layer (II); a conductive pattern; and an electrical circuit.

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Inventors:
FUJIKAWA WATARU (JP)
SAITOU YUKIE (JP)
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2013/059318
Publication Date:
October 03, 2013
Filing Date:
March 28, 2013
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B7/02; C23C26/00; H05K3/18
Foreign References:
JP2009004617A2009-01-08
JPH05327207A1993-12-10
JP2003115662A2003-04-18
JP2010069861A2010-04-02
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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