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Patent Searching and Data


Title:
LAMINATE BODY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/161971
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a laminate body with favorable adhesion between a supporting body and a conductive layer. This laminate body has a conductive layer (A) formed on a supporting body, wherein the conductive layer (A) contains a conductive carbon material and a macromolecular polymer, and the macromolecular polymer in the conductive layer is densely present on a surface that contacts the supporting body.

Inventors:
OI KASUMI (JP)
TAKEUCHI NAOYA (JP)
KISHIMOTO HIROSHI (JP)
OHTANI HITOSHI (JP)
Application Number:
PCT/JP2013/062302
Publication Date:
October 31, 2013
Filing Date:
April 25, 2013
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/18; H01M4/88; H01M4/96; H01M8/02; H01M8/10; H01M12/06; H01M12/08
Foreign References:
JP2009021228A2009-01-29
JP2010086678A2010-04-15
JP2005056583A2005-03-03
JP2011068122A2011-04-07
JP2008147145A2008-06-26
JP2006278037A2006-10-12
JP2006339018A2006-12-14
Other References:
See also references of EP 2842741A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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