Title:
LAMINATE BODY THAT INCLUDES TEMPORARY ADHESIVE FILM; TEMPORARY ADHESIVE COMPOSITION; LAMINATE BODY MANUFACTURING METHOD; AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/090863
Kind Code:
A1
Abstract:
This laminate body comprises, in order, a substrate, a temporary adhesive film, and a support body, wherein the substrate and the temporary adhesive film are divided into multiple sections by cuts extending from the substrate to the temporary adhesive film, and a first adhesive strength between the substrate and the temporary adhesive film is greater than or equal to a second adhesive strength between the temporary adhesive film and the support body. Also provided are a temporary adhesive composition for such a laminate body, a laminate body manufacturing method, and a semiconductor element manufacturing method.
Inventors:
SAIE TOSHIYUKI (JP)
YAMAUCHI AKIRA (JP)
SHIMADA KAZUTO (JP)
YAMAUCHI AKIRA (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2020/041302
Publication Date:
May 14, 2021
Filing Date:
November 05, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J101/32; C09J129/14; C09J133/10; H01L21/301
Foreign References:
| JP2012195414A | 2012-10-11 | |||
| JP2016102165A | 2016-06-02 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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