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Patent Searching and Data


Title:
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BOARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/141662
Kind Code:
A1
Abstract:
Provided are a laminate coated with asymmetric metal foils, and a printed circuit board including same. The laminate coated with asymmetric metal foils comprises one or at least two stacked low-modulus prepregs, and a metal foil which is coated on one side of the one or at least two stacked low-modulus prepregs, or metal foils having different thicknesses which are coated on two sides of the one or at least two stacked low-modulus prepregs. The modulus of elasticity of the low-modulus prepreg is 22 GPa or less after the low-modulus prepreg is cured. By means of the present invention, a low-modulus prepreg having a modulus of elasticity of 22 GPa or less after curing is selected as an insulating material for a laminate coated with asymmetric metal foils, such that the resultant laminate coated with asymmetric metal foils and a printed circuit board manufactured therefrom have a relatively low A-state warpage and a warpage which is obtained after reflow soldering processing, thereby ensuring the reliability of the printed circuit board.

Inventors:
TANG JUNQI (CN)
LI ZHIGUANG (CN)
Application Number:
PCT/CN2021/070942
Publication Date:
July 07, 2022
Filing Date:
January 08, 2021
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
H05K1/02; B32B15/04; B32B15/20; B32B27/12
Foreign References:
CN108559209A2018-09-21
CN108239372A2018-07-03
CN111378098A2020-07-07
CN105061764A2015-11-18
CN202293493U2012-07-04
CN207327759U2018-05-08
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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