Title:
LAMINATE OF CONDUCTIVE FILM, TOUCH PANEL, WIRING BOARD, ELECTRONIC APPLIANCE, TRANSPARENT DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET, AND TRANSPARENT PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2013/168773
Kind Code:
A1
Abstract:
[Problem] To provide a wiring board in which silver ion migration from silver-containing metal wiring is inhibited and the reliability of insulation between the metal wiring lines can be improved.
[Solution] A conductive-film laminate which comprises a transparent substrate, a conductive film that comprises silver and has been disposed on the transparent substrate, and a transparent double-faced pressure-sensitive adhesive sheet laminated to the conductive film, wherein
the amount of silver contained in unit area of the conductive film is 50 µg/mm2 or less and
the transparent double-faced pressure-sensitive adhesive sheet comprises a transparent resin and at least one compound selected from the group consisting of compounds represented by formulae (1) to (3).
Inventors:
MITAMURA YASUHIRO (JP)
OGIKUBO SHINYA (JP)
SHIBATA MICHIHIRO (JP)
OGIKUBO SHINYA (JP)
SHIBATA MICHIHIRO (JP)
Application Number:
PCT/JP2013/063064
Publication Date:
November 14, 2013
Filing Date:
May 09, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B5/14; B32B7/02; C09J7/29; C09J11/06; C09J133/00; H05K1/09; H05K3/28
Foreign References:
| JP2010195971A | 2010-09-09 | |||
| JP2010229246A | 2010-10-14 | |||
| JP2007176961A | 2007-07-12 | |||
| JP2008169259A | 2008-07-24 | |||
| JP2010017862A | 2010-01-28 | |||
| JP2011006658A | 2011-01-13 | |||
| JP2010003875A | 2010-01-07 | |||
| JP2012102219A | 2012-05-31 | |||
| JP2005322792A | 2005-11-17 | |||
| JP2010159365A | 2010-07-22 | |||
| JP2008227008A | 2008-09-25 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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