LAMINATE, CONDUCTIVE MATERIAL, AND PROCESS FOR PRODUCING LAMINATE

Title:

LAMINATE, CONDUCTIVE MATERIAL, AND PROCESS FOR PRODUCING LAMINATE

Document Type and Number:

WIPO Patent Application WO/2012/128327

Kind Code:

A1

Abstract:

A laminate having high interface strength and comprising a copper coating film laminated on an aluminum base or comprising an aluminum coating film laminated on a copper base is produced by a cold spray technique. This laminate (10) comprises: a base (1) comprising aluminum or an aluminum-containing alloy; an intermediate layer (2) arranged on the surface of the base (1) and comprising at least one metal or metalloid selected from silver, gold, chromium, iron, germanium, manganese, nickel, silicon and zinc, or an alloy containing the at least one metal; and a coating film layer (3) arranged on the surface of the intermediate layer (2) and produced by spraying a powdery material composed of copper or a copper-containing alloy in a solid state onto the intermediate layer while accelerating the powdery material together with a gas that is heated to a temperature lower than the melting point of the powdery material to thereby deposit the powdery material onto the intermediate layer.

Inventors:

HIRANO SATOSHI (JP)
YAMAUCHI YUICHIRO (JP)
AKABAYASHI MASARU (JP)
SAITO SHINJI (JP)
HANAMACHI TOSHIHIKO (JP)

Application Number:

PCT/JP2012/057375

Publication Date:

September 27, 2012

Filing Date:

March 22, 2012

Export Citation:

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Assignee:

NHK SPRING CO LTD (JP)
HIRANO SATOSHI (JP)
YAMAUCHI YUICHIRO (JP)
AKABAYASHI MASARU (JP)
SAITO SHINJI (JP)
HANAMACHI TOSHIHIKO (JP)

International Classes:

C23C24/04; B32B15/01; C22F1/04; C22F1/08; C23C28/02; H01B5/02; H01B13/00

Foreign References:

JP2009026953A	2009-02-05
JP2009191345A	2009-08-27
JPH07153866A	1995-06-16
JP2002232096A	2002-08-16
JP2008302317A	2008-12-18
JP2008127676A	2008-06-05

Other References: