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Patent Searching and Data


Title:
LAMINATE, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/115710
Kind Code:
A1
Abstract:
The present invention provides a laminate that results from laminating at least a layer (A) comprising a support body, a primer layer (B), a first conductive layer (C), an insulating layer (D), and a second conductive layer (E), wherein the insulating layer (D) is a layer formed by applying a resin composition (d) onto all or a portion of the surface of at least the first conductive layer (C) and drying the result, and the second conductive layer (E) is a layer configured from a second plating core layer (E-1) formed by applying a fluid (e-1) containing a conductive substance onto all or a portion of the surface of the insulating layer (D), and a second plating layer (E-2) provided to the surface of the second plating core layer (E-1). The laminate has superior adhesion of each layer, and can maintain the superior adhesion even if exposed to high-temperature, high-humidity environments.

Inventors:
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
FUJIKAWA WATARU (JP)
SAITOU YUKIE (JP)
Application Number:
PCT/JP2014/051077
Publication Date:
July 31, 2014
Filing Date:
January 21, 2014
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B15/08; C08J7/043; C08J7/044; C08J7/056; H05K1/03; H05K3/38
Domestic Patent References:
WO2008018589A12008-02-14
WO2013147050A12013-10-03
Foreign References:
JPH08139458A1996-05-31
JP2012246533A2012-12-13
JP2004288818A2004-10-14
JP2004259899A2004-09-16
JPS6139966B21986-09-06
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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