Title:
LAMINATE, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/115710
Kind Code:
A1
Abstract:
The present invention provides a laminate that results from laminating at least a layer (A) comprising a support body, a primer layer (B), a first conductive layer (C), an insulating layer (D), and a second conductive layer (E), wherein the insulating layer (D) is a layer formed by applying a resin composition (d) onto all or a portion of the surface of at least the first conductive layer (C) and drying the result, and the second conductive layer (E) is a layer configured from a second plating core layer (E-1) formed by applying a fluid (e-1) containing a conductive substance onto all or a portion of the surface of the insulating layer (D), and a second plating layer (E-2) provided to the surface of the second plating core layer (E-1). The laminate has superior adhesion of each layer, and can maintain the superior adhesion even if exposed to high-temperature, high-humidity environments.
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Inventors:
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
FUJIKAWA WATARU (JP)
SAITOU YUKIE (JP)
SHIRAKAMI JUN (JP)
FUJIKAWA WATARU (JP)
SAITOU YUKIE (JP)
Application Number:
PCT/JP2014/051077
Publication Date:
July 31, 2014
Filing Date:
January 21, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B15/08; C08J7/043; C08J7/044; C08J7/056; H05K1/03; H05K3/38
Domestic Patent References:
WO2008018589A1 | 2008-02-14 | |||
WO2013147050A1 | 2013-10-03 |
Foreign References:
JPH08139458A | 1996-05-31 | |||
JP2012246533A | 2012-12-13 | |||
JP2004288818A | 2004-10-14 | |||
JP2004259899A | 2004-09-16 | |||
JPS6139966B2 | 1986-09-06 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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