LAMINATE CONTAINING LOW DIELECTRIC CONSTANT ADHESIVE LAYER

WIPO Patent Application WO/2018/030026

A1

Provided is a laminate which exhibits high adhesion not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, and which is able to achieve a high solder heat resistance, while having excellent low dielectric constant characteristics. A laminate (Z) which is obtained by laminating a resin base material and a metal base material with an adhesive layer being interposed therebetween, said adhesive layer containing a carboxyl group-containing polyolefin resin (A). This laminate (Z) is characterized in that: (1) the relative dielectric constant (εc) at the frequency of 1 MHz of a laminate (X) which is obtained by removing the metal base material from the laminate (Z) is 3.0 or less; (2) the dielectric loss tangent (tanδ) at the frequency of 1 MHz of the laminate (X), which is obtained by removing the metal base material from the laminate (Z), is 0.02 or less; (3) the peel strength between the resin base material and the metal base material is 0.5 N/mm or more; and (4) the moist solder heat resistance of the laminate (Z) is 240°C or more.

MIKAMI TADAHIKO (JP)
ITO TAKESHI (JP)
SONODA RYO (JP)
SAKATA HIDEYUKI (JP)

PCT/JP2017/024168

February 15, 2018

June 30, 2017

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TOYO BOSEKI (JP)

B32B15/085; B32B15/08; C09J123/00; H05K3/00

WO2016185956A1	2016-11-24
WO2017077912A1	2017-05-11

JP2002235061A	2002-08-23
JP2000104025A	2000-04-11
JP2000345132A	2000-12-12
JPH1060401A	1998-03-03

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