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Title:
LAMINATE AND COPPER-CLAD LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/108414
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated copper foil for copper-clad laminate, roughening particles are formed on the surface of the copper foil by means of a roughening treatment. The average roughness (Rz) of the roughening treatment surface is 0.5-1.3 µm. The gloss of the roughening treatment surface is 0.5-68, and the ratio (A/B) of the surface area (A) of the roughening particles to the area (B) obtained when the roughening particles are viewed in plan view from the copper foil surface side, is 2.00-2.45.

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Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
Application Number:
JP2012/055592
Publication Date:
July 25, 2013
Filing Date:
March 05, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
International Classes:
C25D7/06; B32B15/08; H05K1/09
Domestic Patent References:
WO2011138876A12011-11-10
WO2010061736A12010-06-03
Foreign References:
JPH02292894A1990-12-04
JPH0987889A1997-03-31
JPH1018075A1998-01-20
JP2008118163A2008-05-22
JP2003023046A2003-01-24
JP2009105286A2009-05-14
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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Claims: