Title:
LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2017/150586
Kind Code:
A1
Abstract:
The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
Inventors:
FUJIWARA TAKESHI (JP)
INAGAKI JYUNICHI (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
INAGAKI JYUNICHI (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
Application Number:
PCT/JP2017/008026
Publication Date:
September 08, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
JNC CORP (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
International Classes:
B32B7/027; B32B9/00; B32B27/20; C08K9/04; C08L63/02; H01L23/36; H01L23/373
Domestic Patent References:
| WO2015170744A1 | 2015-11-12 | |||
| WO2012098735A1 | 2012-07-26 | |||
| WO2016031888A1 | 2016-03-03 |
Foreign References:
| JP2006278558A | 2006-10-12 | |||
| JP2015198104A | 2015-11-09 |
Other References:
See also references of EP 3424702A4
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
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