Title:
LAMINATE, ELECTRONIC DEVICE, RESIN COMPOSITION AND COVER GLASS
Document Type and Number:
WIPO Patent Application WO/2023/277060
Kind Code:
A1
Abstract:
The present invention provides a laminate which exhibits excellent shock resistance. The purpose of the present invention is to provide: an electronic device and cover glass which are obtained using said laminate; and a resin composition used in order to form the resin layer of said laminate. The present invention is a laminate having a thin glass sheet which has a thickness no greater than 200μm and a resin layer which has a thickness of 5μm or greater and is positioned on one or more sides of the thin glass sheet, wherein the breaking energy of the resin layer is at least 1mJ/mm3 and the storage modulus at 25°C is no greater than 2,500MPa, or the present invention is a laminate having a thin glass sheet which has a thickness no greater than 200μm and a resin layer which has a thickness of 5μm or greater and is positioned on one or more sides of the thin glass sheet, wherein the Young's modulus of the resin layer is 50-1,500MPa, inclusive.
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Inventors:
SUEZAKI MINORU (JP)
Application Number:
PCT/JP2022/025950
Publication Date:
January 05, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B17/10; C08G59/18; C08G65/18
Domestic Patent References:
| WO2020153259A1 | 2020-07-30 | |||
| WO2014034507A1 | 2014-03-06 |
Foreign References:
| JP2008107510A | 2008-05-08 | |||
| JP2005206445A | 2005-08-04 | |||
| JP2008303140A | 2008-12-18 | |||
| JP2003122269A | 2003-04-25 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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