LAMINATE FILM AND MANUFACTURING METHOD OF LAMINATE FILM

WIPO Patent Application WO/2019/088079

A1

A laminate film is provided which can suppress cracking of a resin layer during peeling of a protective film and which can suppress uneven curing of the resin layer. This laminate film is provided with a substrate, a resin layer, and a protective film. At one end of the laminate film, the end surfaces of the substrate and the protective film protrude to outside of the end surface of the resin layer, and at the other end of the laminate film, opposite of the aforementioned one end, the end surfaces of the substrate, the resin layer and the protective film are aligned; or, at both one end of the laminate film and at the other end opposite of said one end, the end surfaces of the substrate and the protective film protrude to outside of the end surface of the resin layer. The distance of protruding of the substrate and the protective film at the aforementioned other end is less than the distance of protruding of the substrate and the protective film at the aforementioned one end.

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WO/2020/116209	MULTILAYER FILM FOR LASER PRINTING, MULTILAYER BODY FOR ELECTRONIC PASSPORTS, MULTILAYER BODY FOR PLASTIC CARDS, FILM FOR PLASTIC CARDS, PLASTIC CARD, DATA SHEET FOR ELECTRONIC PASSPORTS, AND ELECTRONIC PASSPORT
JPS5312973	MANUFACTURE OF LAMINATES

NISHIMURA TAKASHI (JP)

PCT/JP2018/040273

May 09, 2019

October 30, 2018

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SEKISUI CHEMICAL CO LTD (JP)

B32B27/20; B32B3/02; B32B27/26; C09J7/20; H05K3/46

JP2016074788A	2016-05-12
JP2014024961A	2014-02-06
JP2008270697A	2008-11-06
JP2005154727A	2005-06-16

MIYAZAKI & METSUGI (JP)

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