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Patent Searching and Data


Title:
LAMINATE FILM AND MANUFACTURING METHOD OF LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2019/088079
Kind Code:
A1
Abstract:
A laminate film is provided which can suppress cracking of a resin layer during peeling of a protective film and which can suppress uneven curing of the resin layer. This laminate film is provided with a substrate, a resin layer, and a protective film. At one end of the laminate film, the end surfaces of the substrate and the protective film protrude to outside of the end surface of the resin layer, and at the other end of the laminate film, opposite of the aforementioned one end, the end surfaces of the substrate, the resin layer and the protective film are aligned; or, at both one end of the laminate film and at the other end opposite of said one end, the end surfaces of the substrate and the protective film protrude to outside of the end surface of the resin layer. The distance of protruding of the substrate and the protective film at the aforementioned other end is less than the distance of protruding of the substrate and the protective film at the aforementioned one end.

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Inventors:
NISHIMURA, Takashi (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
Application Number:
JP2018/040273
Publication Date:
May 09, 2019
Filing Date:
October 30, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
International Classes:
B32B3/02; B32B27/20; B32B27/26; C09J7/20; H05K3/46
Foreign References:
JP2016074788A2016-05-12
JP2014024961A2014-02-06
JP2008270697A2008-11-06
JP2005154727A2005-06-16
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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