Title:
LAMINATE FILM, PACKAGING BAG, AND PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2023/027063
Kind Code:
A1
Abstract:
Provided is a laminate film comprising a base material layer and a sealant layer that includes a polyolefin resin, the base material layer including a first resin layer that includes a polyolefin resin, and a second resin layer that includes a laser-light-absorbing resin, wherein the laser-light-absorbing resin absorbs laser light used in order to form a half-cut line, the polyolefin resin included in the sealant layer and the first resin layer cannot absorb laser light, and the total proportion of polyolefin resin within the entirety of the laminate film is 90 mass% or greater.
Inventors:
SATO MASAKI (JP)
OTSUKA HIROYUKI (JP)
FUKUDA YUKA (JP)
OTSUKA HIROYUKI (JP)
FUKUDA YUKA (JP)
Application Number:
PCT/JP2022/031702
Publication Date:
March 02, 2023
Filing Date:
August 23, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/32; B32B27/00; B65D30/02; B65D33/00; B65D65/40
Domestic Patent References:
| WO2021065888A1 | 2021-04-08 |
Foreign References:
| JP2001287774A | 2001-10-16 | |||
| JP2021160255A | 2021-10-11 | |||
| JP2021160262A | 2021-10-11 | |||
| JP2018079942A | 2018-05-24 | |||
| JP2019166810A | 2019-10-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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