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Patent Searching and Data


Title:
LAMINATE FILM, PACKAGING MATERIAL, PACKAGING BODY, AND METHOD FOR MANUFACTURING LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2019/172340
Kind Code:
A1
Abstract:
This laminate film (10) comprises, in the stated order, at least a base material layer (A), an antistatic layer (B) formed from a resin composition (B3) that contains a thermoplastic resin (B1) and a polymeric antistatic agent (B2) (excluding the thermoplastic resin (B1)), and a heat-sealing layer (C), wherein: the polymeric antistatic agent (B2) content in the antistatic layer (B) is 1-10 mass%, where the entirety of the antistatic layer (B) is 100 mass%; and the antistatic layer (B) is an extrusion coating molded layer formed by extrusion-coating the resin composition (B3) on the base material layer (A).

Inventors:
HASHIMOTO HIDENORI (JP)
TOYOSHIMA SHUN (JP)
Application Number:
JP2019/008952
Publication Date:
September 12, 2019
Filing Date:
March 06, 2019
Export Citation:
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Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
B32B27/18; B29C48/15; B32B27/00; B65D65/40
Domestic Patent References:
WO2008099445A12008-08-21
Foreign References:
JP2016155368A2016-09-01
JP2012035624A2012-02-23
JP2011189714A2011-09-29
JP2008074028A2008-04-03
JP2006513056A2006-04-20
JP2002113771A2002-04-16
JP2000280411A2000-10-10
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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