Title:
LAMINATE FILM, PACKAGING MATERIAL, PACKAGING BODY, AND METHOD FOR MANUFACTURING LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2019/172340
Kind Code:
A1
Abstract:
This laminate film (10) comprises, in the stated order, at least a base material layer (A), an antistatic layer (B) formed from a resin composition (B3) that contains a thermoplastic resin (B1) and a polymeric antistatic agent (B2) (excluding the thermoplastic resin (B1)), and a heat-sealing layer (C), wherein: the polymeric antistatic agent (B2) content in the antistatic layer (B) is 1-10 mass%, where the entirety of the antistatic layer (B) is 100 mass%; and the antistatic layer (B) is an extrusion coating molded layer formed by extrusion-coating the resin composition (B3) on the base material layer (A).
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Inventors:
HASHIMOTO HIDENORI (JP)
TOYOSHIMA SHUN (JP)
TOYOSHIMA SHUN (JP)
Application Number:
PCT/JP2019/008952
Publication Date:
September 12, 2019
Filing Date:
March 06, 2019
Export Citation:
Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
B32B27/18; B29C48/15; B32B27/00; B65D65/40
Domestic Patent References:
| WO2008099445A1 | 2008-08-21 |
Foreign References:
| JP2016155368A | 2016-09-01 | |||
| JP2012035624A | 2012-02-23 | |||
| JP2011189714A | 2011-09-29 | |||
| JP2008074028A | 2008-04-03 | |||
| JP2006513056A | 2006-04-20 | |||
| JP2002113771A | 2002-04-16 | |||
| JP2000280411A | 2000-10-10 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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