Title:
LAMINATE FILM FOR TEMPORARY AFFIXING, SUBSTRATE WORKPIECE USING LAMINATE FILM FOR TEMPORARY AFFIXING, METHOD FOR PRODUCING LAMINATE SUBSTRATE WORKPIECE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/073507
Kind Code:
A1
Abstract:
The present invention provides a laminate film for temporary affixing, which has excellent heat resistance, which can form a flat coating across a substrate, extending to a periphery of the substrate, which can be used to bond a semiconductor circuit formation substrate with a support substrate or a support film layer using a single adhesive, and which can be peeled at room temperature under mild conditions. The laminate film for temporary affixing according to the present invention has at least three layers which are (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein at least the adhesive layer (B) contains a siloxane polymer represented by a certain general formula or a compound represented by a certain general formula.
Inventors:
ODA TAKURO (JP)
ARIMOTO SHINJI (JP)
FUJIWARA TAKENORI (JP)
ARIMOTO SHINJI (JP)
FUJIWARA TAKENORI (JP)
Application Number:
PCT/JP2016/081420
Publication Date:
May 04, 2017
Filing Date:
October 24, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/00; B32B27/34; C09J7/22; C09J7/25; C09J7/30; C09J11/04; C09J11/06; C09J179/08; C09J183/04; C09J183/08; H01L21/304
Domestic Patent References:
| WO2014050878A1 | 2014-04-03 |
Foreign References:
| JPH0415281A | 1992-01-20 | |||
| JP2010132755A | 2010-06-17 | |||
| JPH0936066A | 1997-02-07 | |||
| JP2014525953A | 2014-10-02 |
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