Title:
LAMINATE FILM, AND FILM FOR USE IN PRODUCTION OF SEMICONDUCTOR COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2012/014487
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a laminate film which has excellent heat resistance and stress relaxing properties and is suitable as a component member for a film that is used for the production of a semiconductor.
The present invention relates to a laminate film (10) having a laminated structure composed of at least two layers including the outermost layer (6), wherein the outermost layer (6) comprises a thermoplastic resin composition containing a thermoplastic resin having a melting point of 98°C or higher, at least one layer (a second layer (3)) other than the outermost layer (6) comprises a resin composition containing an ethylene-(unsaturated carboxylic acid) copolymer having an unsaturated carboxylic acid content of 17 mass% or more or an ionomer of the copolymer.
Inventors:
AOYAMA, Masataka (())
青山 正貴 (())
MORIMOTO, Atsushi (())
森本 厚司 (())
青山 正貴 (())
MORIMOTO, Atsushi (())
森本 厚司 (())
Application Number:
JP2011/004287
Publication Date:
February 02, 2012
Filing Date:
July 28, 2011
Export Citation:
Assignee:
DUPONT-MITSUI POLYCHEMICALS CO.,LTD. (5-2 Higashi-Shimbashi 1-chome, Minato-ku Tokyo, 17, 〒1057117, JP)
三井・デュポンポリケミカル株式会社 (〒17 東京都港区東新橋１丁目５番２号 Tokyo, 〒1057117, JP)
AOYAMA, Masataka (())
青山 正貴 (())
MORIMOTO, Atsushi (())
三井・デュポンポリケミカル株式会社 (〒17 東京都港区東新橋１丁目５番２号 Tokyo, 〒1057117, JP)
AOYAMA, Masataka (())
青山 正貴 (())
MORIMOTO, Atsushi (())
International Classes:
H01L21/304; C09J7/02; H01L21/301
Attorney, Agent or Firm:
WASHIDA, Kimihito (8th Floor, Shinjuku First West Bldg. 1-23-7, Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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Claims: