LAMINATE FOR FLEXIBLE PRINTED WIRING BOARDS

Title:

LAMINATE FOR FLEXIBLE PRINTED WIRING BOARDS

Document Type and Number:

WIPO Patent Application WO/2006/067970

Kind Code:

A1

Abstract:

A laminate for flexible printed wiring board excellent in signal response in the high-frequency region. The laminate has a three-layer structure where a reinforcing layer (A), an electrical insulative layer (B), and a conductive layer (C) built up in order of mention. The electric insulative layer (B) is made of a fluorine-containing copolymer containing a repetition unit (a) based on tetrafluoroethylene and/or chrolotrifluoroethylene, a repetition unit (b) based in a fluorine monomer (excluding tetrafluoreoethylene and chrolotrifluoroethylene), and a repetition unit (c) based on a monomer having an acid anhydroxide residue and polymerizable unsaturated bond. The roughness of the surface of the conductive layer (C) in contact with the electric insulative layer (B) is 10 μm or less. The laminate is excellent in signal response in the high-frequency region and flexion resistance.

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Inventors:

IWASA TSUYOSHI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)

Application Number:

PCT/JP2005/022494

Publication Date:

June 29, 2006

Filing Date:

December 07, 2005

Export Citation:

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Assignee:

ASAHI GLASS CO LTD (JP)
IWASA TSUYOSHI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)

International Classes:

H05K1/03; B32B15/082; C08F214/18

Foreign References:

JPS63290735A	1988-11-28
JPH07173446A	1995-07-11
JP2003049387A	2003-02-21

Other References: