Title:
LAMINATE FOR FLEXIBLE WIRING
Document Type and Number:
WIPO Patent Application WO/2011/136061
Kind Code:
A1
Abstract:
Disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which is characterized in that the ratio (A) of the area intensity of an X-ray peak in the X-ray diffraction on the surface of the copper plate (A = [(200)/{(111)+(200)+(220)+(311)}]×100) is larger than 90. Also disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which has particularly high flexibility and enables the formation of fine patterns (highly dense patterns) of a wiring line.
Inventors:
YAMANISHI KEISUKE (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2011/059485
Publication Date:
November 03, 2011
Filing Date:
April 18, 2011
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
YAMANISHI KEISUKE (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
YAMANISHI KEISUKE (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
International Classes:
B32B15/08; C25D7/06; C22C9/00; H05K1/03; H05K1/09
Domestic Patent References:
| WO2010110259A1 | 2010-09-30 |
Foreign References:
| JP2009132967A | 2009-06-18 | |||
| JP2006179537A | 2006-07-06 | |||
| JPH08325781A | 1996-12-10 | |||
| JP2005097676A | 2005-04-14 | |||
| JP2011017036A | 2011-01-27 | |||
| JP2003188535A | 2003-07-04 | |||
| JP2005251926A | 2005-09-15 |
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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