LAMINATE FORMING DEVICE AND LAMINATE FORMING SYSTEM

WIPO Patent Application WO/2023/188910

A1

A laminate forming device (10) manufactures a plurality of laminate formed products by pressing a plurality of to-be-processed objects including at least a base material and a laminate film, the laminate forming device comprising: a central board (11); an upper board (121); and a lower board (122). The central board (11) has a main surface parallel to the horizontal plane. The upper board (121) is provided above the central board (11) such that the distance thereof to the central board (11) fluctuates, and presses an upper to-be-treated object disposed on the upper surface of the central board (11) by approaching the central board (11). The lower board (122) is provided below the central board (11) such that the distance thereof to the central board (11) fluctuates, and presses a lower to-be-treated object disposed on the lower surface of the central board (11) by approaching the central board (11).

JPH09193190	METHOD FOR MOLDING OF RUBBER-BEARING BODY AND APPARATUS
WO/2008/149615	CHOPPED FIBER BUNDLE, MOLDING MATERIAL, AND FIBER REINFORCED PLASTIC, AND PROCESS FOR PRODUCING THEM
JPH09155897	MANUFACTURE OF LAMINATE

UEDA NAOKI (JP)
YAMAMOTO TAKAYUKI (JP)

PCT/JP2023/005022

October 05, 2023

February 14, 2023

Click for automatic bibliography generation  

JAPAN STEEL WORKS LTD (JP)

B29C43/18; B29C63/02; B29C43/34; B29C43/36; B29C43/50; B29C43/52; B29C43/58; B32B37/10; H05K3/46

JP2004114465A	2004-04-15
JPS6281296A	1987-04-14
JP2008012918A	2008-01-24
JPS62140811A	1987-06-24

IEIRI Takeshi (JP)

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