Title:
LAMINATE, INTEGRATED MOLDING, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/080238
Kind Code:
A1
Abstract:
Provided is a laminate comprising reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. Also provided is an integrated molding. This laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher then 180°C, and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.
Inventors:
FUJIOKA TAKASHI (JP)
HONMA MASATO (JP)
HONMA MASATO (JP)
Application Number:
PCT/JP2015/081560
Publication Date:
May 26, 2016
Filing Date:
November 10, 2015
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B5/28; B29B11/12; B29C43/18; B29C45/14
Foreign References:
| JP2007254718A | 2007-10-04 | |||
| JP2008050598A | 2008-03-06 | |||
| JPH07238174A | 1995-09-12 | |||
| JPH05117411A | 1993-05-14 | |||
| JP2007523769A | 2007-08-23 |
Other References:
See also references of EP 3222418A4
Download PDF: