Title:
LAMINATE, LAYER-FORMING COMPOSITION, LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ELECTRONIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/172551
Kind Code:
A1
Abstract:
The present invention provides a laminate in which an electroconductive-material-containing layer has excellent adhesiveness, a layer-forming composition with which it is possible to form such a laminate, a layer, a manufacturing method, and an electronic element comprising such a laminate. One embodiment of the present invention is a laminate having a substrate, a first layer that includes a compound having a condensed polycyclic hydrocarbon structure, and a second layer that includes an electroconductive material, in the stated order.
Inventors:
NOSAKA NAOYA (JP)
TAKANASHI KAZUNORI (JP)
TAKANASHI KAZUNORI (JP)
Application Number:
PCT/JP2021/042784
Publication Date:
August 18, 2022
Filing Date:
November 22, 2021
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
B32B9/00; B32B7/025; C01B32/174; H01B5/14; H01B13/00
Domestic Patent References:
| WO2016195091A1 | 2016-12-08 | |||
| WO2018164267A1 | 2018-09-13 | |||
| WO2021054337A1 | 2021-03-25 | |||
| WO2021187599A1 | 2021-09-23 |
Foreign References:
| JP2016134474A | 2016-07-25 | |||
| JP2000086871A | 2000-03-28 | |||
| JP2002050481A | 2002-02-15 | |||
| JP2004352655A | 2004-12-16 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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