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Patent Searching and Data


Title:
LAMINATE AND MANUFACTURING METHOD FOR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/038701
Kind Code:
A1
Abstract:
Provided is a laminate that comprises a substrate and a metal layer, and that is excellent in adhesion of the metal layer to the substrate both initially and over time while also exhibiting excellent conductivity of the metal layer. One embodiment of the present disclosure is a laminate 1 comprising a substrate 2 and a metal layer 3 laminated on the substrate 2. In the laminate 1, a portion of the metal layer 3 is embedded at a depth of 10-100 nm from the surface of a contact layer that contacts the metal layer 3. Another embodiment of the present disclosure is a method for manufacturing a laminate 1 in which a metal layer 3 is laminated on a substrate 2. The manufacturing method comprises: an application step in which a coating film is formed by applying, onto the substrate 2 or a contact layer which is an acceptor layer 4 provided on the substrate 2, a paint composition that contains conductive metal particles and a solvent; a dissolving step in which at least a portion of the contact layer surface is dissolved by the solvent; and a firing step in which the metal layer 3 is formed by firing the paint composition constituting the coating film.

Inventors:
SAKAMOTO HIROKATSU (JP)
Application Number:
PCT/JP2023/025304
Publication Date:
February 22, 2024
Filing Date:
July 07, 2023
Export Citation:
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Assignee:
DAICEL CORP (JP)
International Classes:
B32B15/08; B05D3/02; B05D5/12; B05D7/24; C23C24/08; H05K3/38
Domestic Patent References:
WO2016194964A12016-12-08
WO2019240217A12019-12-19
WO2017057301A12017-04-06
WO2021147403A12021-07-29
Foreign References:
JP2007223224A2007-09-06
JP2008200875A2008-09-04
JP2022048068A2022-03-25
JP2010132967A2010-06-17
JP2017144632A2017-08-24
JP2019181711A2019-10-24
JP2010074139A2010-04-02
JP2014194465A2014-10-09
US20160152059A12016-06-02
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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