Title:
LAMINATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/034290
Kind Code:
A1
Abstract:
The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion layer, and a substrate in said order. The substrate is provided with a dielectric multilayer film in which dielectric layers having different refractive indexes are alternately laminated on an outer surface of the substrate. The substrate provided with the dielectric multilayer film is disposed on the adhesion layer such that the dielectric multilayer film adheres in a peelable manner to the adhesion layer.
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Inventors:
MIYAGOE TATSUZO (JP)
FUJIWARA TERUO (JP)
FUJIWARA TERUO (JP)
Application Number:
PCT/JP2017/029390
Publication Date:
February 22, 2018
Filing Date:
August 15, 2017
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B32B7/02; B32B9/00; G02B1/115; G02B1/113
Domestic Patent References:
| WO2016080312A1 | 2016-05-26 |
Foreign References:
| JP2015182393A | 2015-10-22 | |||
| JP2013022731A | 2013-02-04 | |||
| JP2007328284A | 2007-12-20 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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