Title:
LAMINATE, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND ANTENNA
Document Type and Number:
WIPO Patent Application WO/2020/213515
Kind Code:
A1
Abstract:
The present invention provides a laminate (metal clad laminate) which comprises a dielectric layer that has a low water absorption rate and excellent dielectric characteristics, heat resistance, and adhesion, and a metal foil layer, and which has excellent properties as materials or the like of printed circuit boards such as flexible printed circuit boards and rigid printed circuit boards. The laminate has at least a three-layer structure and includes the metal foil layer, a non-thermoplastic polyimide layer P, and a tetrafluoroethylene polymer layer F, at least one of the outermost layers being the metal foil layer. The layer F is present on at least one surface of the layer P. The layer P has a water absorption rate of less than 1.5%, and the absolute value of the coefficient of linear expansion thereof is 25 ppm/°C or less.
Inventors:
KASAI WATARU (JP)
HOSODA TOMOYA (JP)
YAMABE ATSUMI (JP)
TERADA TATSUYA (JP)
HOSODA TOMOYA (JP)
YAMABE ATSUMI (JP)
TERADA TATSUYA (JP)
Application Number:
PCT/JP2020/016020
Publication Date:
October 22, 2020
Filing Date:
April 09, 2020
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B27/30; B32B15/08; B32B15/082; B32B27/34; C08G73/10; H01Q1/38; H05K1/03
Foreign References:
| JP2017024265A | 2017-02-02 | |||
| JP2011051203A | 2011-03-17 | |||
| JP2018172790A | 2018-11-08 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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