Title:
LAMINATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/048548
Kind Code:
A1
Abstract:
This laminate comprises a film-shaped base material and an antistatic layer provided on one surface of the base material. The surface energy of the surface of the base material that is in contact with the antistatic layer is 35-70 mN/m, and the thickness deviation of the antistatic layer is less than 30%.
Inventors:
KOTERA SEIGO (JP)
TAKENAKA SATOSHI (JP)
NAKAMURA JUNETSU (JP)
TAKENAKA SATOSHI (JP)
NAKAMURA JUNETSU (JP)
Application Number:
PCT/JP2023/031100
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B27/18; B32B7/025; B32B27/00; H01L21/56
Domestic Patent References:
| WO2022153794A1 | 2022-07-21 | |||
| WO2016093178A1 | 2016-06-16 | |||
| WO2015133630A1 | 2015-09-11 | |||
| WO2016158037A1 | 2016-10-06 |
Foreign References:
| JP2007152930A | 2007-06-21 | |||
| JP2014201647A | 2014-10-27 | |||
| JP2009083271A | 2009-04-23 | |||
| JP2017111865A | 2017-06-22 | |||
| JP2018161824A | 2018-10-18 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: TEMPERATURE CONTROL SYSTEM, WORK MACHINE, AND TEMPERATURE CONTROL METHOD
Next Patent: CONNECTOR
Next Patent: CONNECTOR