Title:
LAMINATE, METHOD FOR PRODUCING LAMINATE, LAMINATED SUBSTRATE, AND METHOD FOR PRODUCING LAMINATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/048206
Kind Code:
A1
Abstract:
One embodiment of the present disclosure provides a method for producing a laminated substrate, the method including: laminating a metal plate, a semicured-resin-impregnated plate, and an electroconductive plate in the stated order; heat-treating the semicured-resin-impregnated plate at a temperature of 200°C or lower to cure the semicured resin, thereby bonding a cured product of the semicured-resin-impregnated plate, the metal plate, and the electroconductive plate to obtain a laminate; and forming a wiring pattern on the electroconductive plate in the laminate. As seen in a top view, the electroconductive plate has a substrate part that is present on the semicured-resin-impregnated plate, and a portion that is present outside of the main surface of the semicured-resin-impregnated plate.
Inventors:
MINAKATA YOSHITAKA (JP)
IWAKIRI SHOJI (JP)
DEKIOKA MASASHI (JP)
YOSHIMATSU RYO (JP)
SAKAGUCHI SHINYA (JP)
IWAKIRI SHOJI (JP)
DEKIOKA MASASHI (JP)
YOSHIMATSU RYO (JP)
SAKAGUCHI SHINYA (JP)
Application Number:
PCT/JP2023/028612
Publication Date:
March 07, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B7/05; H05K1/05
Domestic Patent References:
| WO2014196496A1 | 2014-12-11 |
Foreign References:
| JP2022081849A | 2022-06-01 | |||
| JP2016103611A | 2016-06-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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